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INDUSTRY TOPICS

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PRODUCT INNOVATIONS - Lattice Semiconductor - Designer software design tool suite
Mixed signal software design tool supports automotive version of power manager devices

Lattice Semiconductor announced the release of its PAC-Designer software design tool suite, version 4.99a. The tool suite now supports Lattice’s AECQ100-qualified automotive Power Manager II (LA-ispPAC-POWR1014/A) devices.

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PRODUCT INNOVATIONS

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Toshiba provides - ASIC development
Design platform and support for development of iDTV tailored ARM-based MPEG-4 processor

Rohde & Schwarz - mobile radio scanner
Universal mobile radio scanner for setting up and optimizing WiMAX networks

Micronas - frame-rate converter
Frame-rate converter with improved picture performance

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ANALYSIS-MARKET-TRENDS

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IMS Research - New report
Power semis motor ahead

Strategy Analytics - Automotive Electronics Service report
Stop-start micro-hybrid systems to reach 20 million units by 2015

iSuppli recommends
How AM-OLED vendors can succeed

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NEWS

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Online ticket registration for visitors to the electronica 2008
Be sure to get your entrance ticket now to benefit from attractive prices

Joint research project started
BMZ, University of Applied Sciences Aschaffenburg and Linde develop energy storage system for electric vehicles

International CEO Round Table during electronica 2008
What contribution is the semiconductor industry making to climate protection?



	EVENTS

Munich International Congress Center (ICM)
electronica automotive conference 2008 with Experts from Leading International Companies

Booming market India
"Call for Presentations" for the Automotive Symposium running parallel to "electronicIndia 2008"

Thurs 19th March 2008, The Royal Society, London
3rd International Conference on Nanotechnology and Smart Textiles for Industry, Healthcare and Fashion

Industrial Topics

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APPLICATIONS - Heller Industries - Reflow ovens
Reflow ovens solution to the challenges of increased productivity and greater flexibility

The 1900EXL from Heller's newest generation of reflow ovens provides 25% higher airflow for enhanced temperature uniformity, repeatability and high-load handling. The 1900EXL features Heller's new, enlarged heating tunnel and baffle-free design, for six-sigma consistency, zone-to-zone and oven-to-oven.

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PRODUCT INNOVATIONS

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Speedprint - stencil printer
New smallest inline stencil printer

JTAG Technologies - boundary-scan
Easy-to-use software tool with extraordinary test comprehensiveness

Essemtec - twin vacuum table
New placement machine for flex board and film substrate features twin vacuum table

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ANALYSIS-MARKET-TRENDS

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Electronics.ca Publications - Industry Report
40% of the world's PCB is produced in the uppermost manufacturing bases - China and Taiwan

EMS - ODM - CM Industry
Global contract manufacturing transforms by 2013

Silicon solar production initiatives
Thin-film technology - new solar PV trend in Taiwan



	NEWS

STMicroelectronics, STATS ChipPAC and Infineon
Milestone in establishing wafer-level-packaging industry standard

Essemtec
New Website with integrated application reports

At VLSI Symposium
IMEC reports progress on simplified high-k/metal gate process for the 32nm node

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electronicIndia
September 02-05, 2008 link

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October 13-16, 2008 link

electronica
November 11-14, 2008 link

News - 22.08.2008

Design platform and support for development of iDTV tailored ARM-based MPEG-4 processor
Toshiba Electronics Europe (TEE) has successfully completed a complex ASIC development for Neotion, the French fabless semiconductor manufacturer specialising in MPEG-4 solutions for integrated digital TV (iDTV).

Power semis motor ahead
Of all the semiconductors and components used in industrial motor drives, the power semiconductor segment is the biggest revenue opportunity, according to a new report by IMS Research.