Momentive Performance Materials

Momentive Performance Materials Inc. is a premier specialty materials company, providing high-technology materials solutions to the silicones, quartz and ceramics markets. The [...] la description

Thermal Management Silicones for Electronics

Thermal Management Solutions from Momentive Performance Materials
Long-term, reliable protection of sensitive electronic components is essential to many electronic applications today. Increasingly small systems and rising circuit densities have resulted in hotter operating temperatures, and driven demand for high-performance solutions for heat dissipation. Designers confronting these challenges will find a range of solutions from Momentive Performance Materials, Silicones. Our SilCool* family of adhesives and compounds deliver the highthermal conductivity, thin bond lines, and low thermal resistance required for high-performance components. For applications requiring moderate level thermal management, Momentive offers a selection of standard-grade silicone adhesives, encapsulants, and potting materials. Thermally Conductive Silicone Grease Compounds
Momentive's thermally conductive SilCool grease compounds offer excellent thermal conductivity, as well as excellent stability, penetration, temperature resistance, and low bleed. These properties enable SilCool grease compounds to draw heat away from devices, contributing to improved reliability and operational efficiency of electronic components. The combination of processing performance and thermal conductivity that these grease compounds offer makes them good candidates for thermal interface applications in high-performance devices and packages, such as TIM2 applications in CPUs and MPUs. (p. 3~4)

Product Selector Guide
The task of component design challenges materials suppliers to address an array of thermal management applications that impose a variety of performance and process profiles. Momentive brings to this challenge a broad and versatile range of thermally conductive materials. Whether an application requires superior performance in thermal interfaces, general heat dissipation in assemblies, thermal performance in board-level assembly, or potting and encapsulation, we offer a solution to help match the application's parameters.

Application
High

Performance Characteristics
thermal conductivity Low separation Wide operating temperatures


Solutions
. . . . . TIG655 TIG830SP TIG4000 TIG210BX TIG2000
4.8 4.1 4.0 2.1 2.0
W/m.K W/m.K W/m.K W/m.K W/m.K W/m.K W/m.K W/m.K W/m.K W/m.K W/m.K W/m.K W/m.K W/m.K W/m.K W/m.K W/m.K W/m.K

Thermal interface in highperformance devices / semiconductor packages such as TIM1 applications, in MPUs & CPUs

Low thermal resistance Minimal ionic impurities


High thermal conductivity Structural adhesion Minimal ionic impurities

Low thermal resistance Thin bond lines Low modulus & stress


. TIA500R 5.0 . TIA250R 2.5 . XE13-C1862PT 2.4 . . . . . TIG655 TIG830SP TIG4000 TIG210BX TIG2000
4.8 4.1 4.0 2.1 2.0

Thermal interface between high performance devices, (MPUs, CPUs) & heat dissipation devices (heat sinks) in TIM2 applications

High thermal conductivity Low separation Wide operating temperatures


Low thermal resistance Minimal ionic impurities


High thermal conductivity Structural adhesion Minimal ionic impurities High thermal conductivity Structural adhesion

Low thermal resistance Thin bond lines Low modulus & stress


. TIA500R 5.0 . TIA250R 2.5 . XE13-C1862PT 2.4 . XE11-C3165 2.6 . XE11-C2148 2.2 . TIS360C . TIS361C . TIG1000 . TSE3282-G . TSE3281-G



Thermal management for Optical Pick-Ups, automotive control units and power supplies





Low thermal resistance Room temperature cure



Low thermal resistance High thermal conductivity Non adhesive, repairableRoom temperature cure

3.6 W/m.K 3.6 W/m.K 1.0 W/m.K 2.0 W/m.K 1.7 W/m.K
W/m.K

Thermally Conductive Silicone Adhesives
Momentive Performance Materials developed its family of SilCool thermally conductive adhesives to help deliver thin bond lines, which contribute to low thermal resistance while providing excellent adhesion and reliability. This series of heat-cured, 1-Part adhesives excel in thermal interface applications that demand good structural adhesion. Examples include spreaders and heat generators, and thermal interfaces to heat sinks in TIM2 applications. Additional thermal adhesives from Momentive offer the process convenience of 1-Part condensation cure with moderate heat dissipation. Target applications include board assemblies and sealants in power modules and sensors. (p. 5~6)

Thermal interface with heat dissipation devices in control units, medium-performance CPUs, etc.



Moderate thermal conductivity Moderate thermal conductivity Structural adhesion Moderate thermal conductivity Structural adhesion



Wide operating temperatures





Low thermal resistance

Board level assembly & Power Supply component assembly Rubber and Gel potting / encapsulation in power modules, converters, IGBT units





Low thermal resistance Room temperature cure

. XE11-B5320 1.3 . . . . .



Moderate thermal conductivity Low viscosity



Low thermal resistance Flame retardancy

TSE3331 0.63 W/m.K TSE3331K 0.53 W/m.K TSE3380 1.68 W/m.K TSE3080 (gel) 0.63 W/m.K TSE3081 (gel) 1.26 W/m.K

Thermally Conductive Silicone Portfolio Map
Thermally Conductive Potting & Encapsulation
Thermal Conductivity (W/m.K)

5.00

Momentive Performance Materials offers a variety of condensation cure and 2-Part heat cure elastomeric rubber grades, as well as 2-Part heat cure gels. This selection of materials combines good thermal conductivity with low-viscosity to pot in deep, intricate cavities of electronic components. After cure, these materials provide excellent electric insulation, environmental protection, and resistance to vibration and shock for sensitive components. Common applications include power modules, sensors, converters, IGBT units, and connectors. Several grades also offer UL recognition for flame retardant performance. (p. 7~8)

3.00

Thermal Conductivity (W/m.K)

4.00

1 part heat cure 1 part condensation cure 2 part heat cure 2 part heat cure (gel) Surface curing compound

5.00

TIA500R
TIS361C TIS360C

TIG655

4.00 3.00

TIG4000

TIG830SP

TIA250R
XE13-C1862PT TSE3281-G

2.00
TSE3282-G
TSE3380

XE11-C3165 XE11-C2148

2.00 1.00

TIG210BX

1.00 0.80 0.50 0

XE11-B5320

TIG2000

TSE3081

Surface Curing Silicone Compound
Momentive's Surface Curing Silicone Compounds cure upon exposure to atmospheric moisture to form a cured exterior surface while maintaining a pasty consistency on the interior. Its performance is similar to a grease, however it is characterized by extremely low bleed and volatile contents. These non-adhesive compounds contribute to process ease and repairability in a broad array of thermal applications. (p. 9)
1

TIG1000

TSE3331
TSE3080 TSE3331K

0.80 0.50

grease
grease (low thermal resistance)
grease (low oil bleed)

10

20

30

40

50 60 Viscosity (Pa.S)

180

320

450 Non-Sag

0

250

300 350 Penetration

400

2

SilCool* Silicone Grease Compounds
Momentive's family of SilCool series silicone grease compounds feature outstanding thermal conductive and dielectric properties, excellent workability, virtually no oil separation, and minimal weight loss at elevated temperatures. These high-performance grease products were formulated to help address heat management challenges resulting from higher frequencies, higer power, and miniaturization in the development of electric and electronic devices.

Initial Performance Data
Thermal Resistance is proportional to the thickness of the material through which the heat must travel. The ability to control and reduce thickness (BLT) of the thermal interface is a key factor in the component assembly process. Increases in assembly pressures are known to contribute to reductions in BLT, and subsequently, reduced thermal resistance.

SilCool Grease - Initial Properties Thermal Resistance (mm2.K / W) 40
0

SilCool Grease - BLT vs. Assembly Pressure
BX

20

T

00 IG4

0

TIG

BLT (µm)

Key features: . Highly workable ­ excels in automated dispensing, screen printing, and stamping applications . High thermal conductivity . Wide operating temperature range . Low oil separation and minimal weight loss at elevated temperatures . Minimal ionic impurities & excellent dielectric properties

TIG

210

60 50
830 SP
TIG210BX TIG2000 TIG4000 TIG830SP

30
TI

G2

00

40 30 20
TIG655

10

TIG

655

10 0 25 50 75 BLT (µm) 100 125 0 50 100 150 200 Pressure (kPa) 250 300

Product Details
Properties
Features Property / Color Thermal Conductivity1 Specific Gravity Penetration
o o

TIG655
High thermal conductivity, low thermal resistance

TIG830SP
High thermal conductivity, low thermal resistance, low viscosity

TIG4000
High thermal conductivity

TIG210BX
Low oil bleed, temperature resistance

TIG2000
Pale Blue Paste 2.0 24 (50µm) 2.80 400 150 <0.1 <0.1 1x106 5 <100 -

TIG1000
White Paste 1.0 33 (50µm)
Thermal Resistance (mm2.K / W)

Test Conditions: Sandwich 0.02ml of material between10mm×10mm silicon dies, and apply desired pressure for 1 minute. Measure BLT.

Gray Paste
W/m.K
2.

Gray Paste 4.1 8 (30µm) 2.88 310 300 0.0* 0.3 1x104 4.5 <100 0.5, 0.0, 0.1

Gray Paste 4.0 15 (50µm) 2.80 300 0.0* <0.1 2x106 5 20 each <2

Gray Paste 2.1 20 (45µm) 2.90 345 250 0.0* 0.1 1x106 3.0 <100 2.0, 0.0, 0.0

4.8 5 (15µm) 3.05 310

Reliability Data
SilCool Grease - Thermal Shock Reliability

Thermal Resistance2(BLT) mm
(23 C)
o

K/W

SilCool Grease - Temperature / Humidity Reliability Thermal Resistance (mm2.K / W) 25
0 hours
0 cycles 500 cycles 1000 cycles

2.50 340 0.1 0.1 3x106 30 -

25

3

(23 C)
o

Viscosity(23 C) Bleed3(150 C/24h) Evaporation
(150 C/24h)
o

Pa.s wt% wt% M.m kV/0.25mm ppm ppm

220 0.0* 1 1x104 4.5 <100 0.5, 0.0, 0.1

20

20
15 10 5 0

250 hours

15 10 5 0

Volume Resistivity4 Dielectric Strength Volatile Siloxane (D3-D10) Ionic Content5(Na/K/Cl) 30ml syringe 200g tube 1kg can 2kg can 2kg bottle
1 5

·

· · ·

Bulk sample measurement (hot wire method), 2Laser flash analysis on a Si-Si sandwiched material, Ion chromotography analysis on water extracts, *Measurement limit Typical property values should not be used as specifications

3JIS K 2220,

· · ·

· ·
4

·

TIG830SP TIG655 TIG2000 TIG4000 Test Conditions: Sandwich material between10mm×10mm silicon die and AL, and apply 130kPa pressure. Thermal cycle (-55oC125oC, dwell time 10 minutes at each extreme). Measure thermal resistance using laser flash method.

TIG830SP TIG655 TIG2000 TIG4000 Test Conditions: Sandwich material between10mm×10mm silicon die and AL, and apply 130kPa pressure. High temperature / humidity test (85oC, 85%RH, 250 hours). Measure thermal resistance using laser flash method.

Packaging
3

MIL-S-8660B,

Handling & Storage
. Wear eye protection and protective gloves as required when handling. . Use in a well ventilated area. . Store in a dark, cool place out of direct sunlight. . TIG655: Seal the product and store below 10oC.
Heatsink TIM2 Heat Spreader TIM1 Die

SilCool grease in TIM1 and TIM2 semiconductor applications.

4

SilCool* Silicone Adhesive - Addition Cure
The SilCool series silicone adhesives from Momentive Performance Materials offer 1-Part, heat curable materials that bond well to a wide variety of substrates without the need for primers. They help deliver outstanding thermal conductivity, low thermal resistance, excellent dielectric properties, and low stress. SilCool adhesives are excellent candidates for addressing the heat management challenges arising from the higher frequencies, power, and miniaturization in today's electronic devices. Designed to efficiently conduct heat, these materials are valuable additions to semiconductor packages that incorporate heat-generating chips, heat spreaders, and heat sinks (TIM1 & TIM2). Key features: . Ready to use - one component . Highly workable ­ excels in automated dispensing, screen printing, and stamping applications . Fast cure & good adhesion . High thermal conductivity . Low thermal resistance . Low modulus & stress . Reliable in a wide temperature range . Compatible with high-temperature lead-free processing . Minimal ionic impurities & excellent dielectric properties
Heatsink TIM2 Heat Spreader TIM1 Die

Initial Performance Data
Thermal Resistance is proportional to the thickness of the material through which the heat must travel. Increases in pressure during the component assembly process are known to contribute to reductions in thickness of the thermal interface (BLT), and subsequently, reduced thermal resistance.
SilCool Adhesive - Initial Properties Thermal Resistance (mm2.K / W) 60 50 40 30 20 10 0 50 75 100 BLT (µm) 125 150
TIA 250 R

XE1

1 3-C

862

PT

TIA50

0R

SilCool adhesive in semiconductor applications.

Test Conditions: Sandwich material between10mm×10mm silicon dies, and cure for 1 hour at 150oC. Measure thermal resistance using laser flash method.

Product Details
Properties
Features Type Property Color Viscosity
(23 C)
o

Reliability Data
Thermal Resistance (mm2.K / W)
0 cycles 500 cycles

Thermal Resistance (mm2.K / W)

TIA500R4
High thermal conductivity

TIA250R4
Good thermal conductivity. Fast cure

XE13-C1862PT TSE3282-G
Good thermal conductivity. High elongation

TSE3281-G
1 Part Flowable Gray 60 150/1 1.7 35 (50µm) 2.70 84 4.5 50 2.5 140 -120 4.8x106 15 each <10 <0.6

SilCool Adhesive - Thermal Shock Reliability 80 70 60 50 40 30 20 10 0 TSE3281-G TSE3282-G

SilCool Adhesive - Temperature / Humidity Reliability 80 70 60 50 40 30 20 10 0 TSE3281-G TSE3282-G
0 hours 250 hours

1 Part Flowable Gray 20 150/1 2.0 33 (50µm) 2.70 80 4.0 50 2.5 140 -120 4.8x106 23 each <10 <0.6

1 Part
(uncured)

1 Part Flowable Gray 70 120/0.5 2.5 29 (50µm) 2.90 63 3.0 70 2.3 130 -120 4.8x106 18 each <5 <0.6

1 Part Flowable Gray 64 150/1 2.4 25 (50µm) 2.85 64 1.6 80 1.7 130 -120 5.0x106 20 each <5 <0.6

Flowable Gray
Pa.s
O

50 150/1 5.0 11 (50µm) 3.42 95
K/W

Cure Condition Thermal Conductivity Specific Gravity Hardness
(Type A) (23 C)
o

C/h

1

W/m.K
2.

Thermal Resistance2(BLT) mm

Tensile Strength Elongation Adhesion CTE Glass Transition Temp. Volume Resistivity Dielectric Strength Ionic Content3(Na/K/Cl) Moisture Absorption 30ml syringe 200g tube 333ml cart. 1kg can 2kg can
1 4

MPa % MPa ppm/K
O

7.2 10 3.8 (Ni/Ni) 90 -120 4.8x106 20 each <1 <0.6

Test Conditions: Sandwich material between8mm×8mm silicon die and AL, assemble at 69kPa and cure at 150oC for 1 hour. Thermal cycle (-55oC125oC, dwell time 10 minutes at each extreme). Measure thermal resistance using laser flash method.

Test Conditions: Sandwich material between8mm×8mm silicon die and AL, assemble at 69kPa and cure at 150oC for 1 hour. High temperature / humidity test (85oC, 85%RH, 250 hours). Measure thermal resistance using laser flash method.

(Al lap shear)

C

M.m kV/mm ppm wt%

Handling & Storage
Upon receipt, immediately transfer the material to a suitable storage environment. Refer to individual product data sheets for required storage conditions. To avoid formation of voids, always maintain syringes in an upright position - with the syringe tip facing down. Do not lay syringes on their sides under any circumstances. Prior to application, allow the material to warm to room temperature. Refer to individual product data sheets for approximate time intervals for achieving room temperatures. Do not use the syringes or open the cans before contents reach ambient temperature. Wipe all condensation from the syringes or the cans prior to use. TIA500R: Planetary mixers are recommended for syringe packages prior to use. Wear protective goggles and gloves, and maintain adequate ventilation in the work place when working with these materials. Please refer to the Material Safety Data Sheet for preventing and controlling hazardous accidents. Substrates containing water, sulfur, nitrogen compounds, organic metallic salts, phosphorus compounds, etc. can inhibit curing. A sample test should always be conducted to determine compatibility.

·
2

· ·
3

Bulk sample measurement (hot wire method),

Contact a Momentive Performance Materials sales representative for package availability.

Typical property values should not be used as specifications

Packaging
5

·

Laser flash analysis on a Si-Si sandwiched material,

Ion chromatography analysis,

6

Silicone Adhesive - Condensation Cure
Momentive Performance Materials offers a wide range of condensation cure adhesives & sealants that deliver thermal conductive performance. These materials cure to form an elastic rubber when exposed to atmospheric moisture at room temperatures, eliminating the need for heat ovens. The result is a unique combination of process efficiency and excellent thermal conductivity. Our condensation-cure adhesives and sealants are commonly applied in board assembly and sensor applications that require moderate thermal management performance and ease of use.

Silicone Potting / Encapsulants
Momentive Performance Materials' silicone potting materials deliver thermal conductive performance, contributing to the long-term reliability of heat-generating electronic components. These low viscosity rubbers and gels provide moisture and vibration protection in power modules, converters, IGBTs, and other sensitive devices. Many also offer flame retardant properties and are UL recognized.

Product Details
Properties
Features Type Property Color Viscosity
(23 C)
o

Product Details
XE11-C3165 XE11-C2148 XE11-B5320
1 1

Potting Rubber TSE3380
2 Part Heat Cure

Potting Gel TSE3331K
2 Part Heat Cure Flowable 100:100 Gray 8 2.6 120/1 0.53 1.43 45 3.1 120 1.6 190 6.0x106 22

High thermal conductivity, strong adhesion

High thermal conductivity, strong adhesion

Properties
Components Type Property Color Pot Life
(23 C)
o

Fast tack free time, UL recognized

TSE3331
2 Part Heat Cure Flowable 100:100 Gray 8 3.5 120/1 0.63 1.51 60 2.9 70 1.3 170 2.0x106 26

TSE3081
2 Part Heat Cure Flowable 100:100 Black 3 20 100/1 1.26 2.50 10 1.0x107 22

TSE3080
2 Part Heat Cure Flowable 100:100 Black 3 7.0 100/1 0.63 1.53 25 1.0x107 22

TSE3380(A) TSE3380(B) TSE3331(A) TSE3331(B) TSE3331K(A) TSE3331K(B) TSE3081(A) TSE3081(B) TSE3080(A) TSE3080(B)

1 Part
(uncured)

1 Part Semi-Flowable Gray 320 10 2.2 2.88 88 5.2 40 4.2 110

1 Part Non-Flowable White 5 1.3 2.59 80 3.6 40 1.3 120
7

Semi-Flowable Light Gray
Pa.s min W/m.K

(uncured) ((A):(B) by weight)

Flowable 100:100 Gray
h Pa.s
O

Mixing Ratio

180 10 2.6 3.00 93

Tack Free Time Thermal Conductivity Specific Gravity Hardness
(Type A) (23 C)
o

8 40 150/0.5 1.68 2.70 70 -

Viscosity

(23 C)
o

Cure Condition Thermal Conductivity Specific Gravity Hardness
(Type A) (23 C)
o

C/h

W/m.K

Tensile Strength Elongation Adhesive Strength CTE Volume Resistivity Dielectric Strength Volatile Siloxane (D3-D10) Flame Retardancy 280g tube 333ml cart. Pkg.
Thermal Resistance (mm2.K / W)
7

MPa % MPa ppm/K M.m kV/mm wt%

6.5 40 2.6 100 7.0x10 20 0.001 6

Penetration Tensile Strength
7 MPa % MPa ppm/K M.m kV/mm

2.5 100 1.5 140 2.1x106 15

1.0x10 20 0.002 -

2.0x10 17 0.010

Elongation Adhesive Strength CTE Volume Resistivity Dielectric Strength Flame Retardancy 1kg can 1.5kg can 5kg can 6kg can 20kg pail can 25kg pail can Packaging

UL94 HB

1 Contact a Momentive Performance Materials sales representative for package availability.

·
Handling & Storage
. Wear eye protection and protective gloves as required while handling. . Use in a well ventilated area. . Store in a dark, cool place out of direct sunlight.

Typical property values should not be used as specifications

· ·

-

· ·

Initial Performance Data
Initial Properties
100
80
X 0 32 -B5 11 E

· · · ·

UL94 V-0

· · · ·

· ·

UL94 V-0

· ·

· ·

-

· ·

· ·

-

· ·

Typical property values should not be used as specifications

60
40 20 0

1XE1

C21

48

1 XE1

65 -C31

Handling & Storage
. . . .
150

For 2 Part grades, mix both parts thoroughly before use, as filler sedimentation may occur during storage. Wear eye protection and protective gloves at all times. Maintain adequate ventilation in the work place at all times. Store in a dark, cool place out of direct sunlight.

25

50

75 100 BLT (µm)

125

8

Surface Curing Silicone Compound
Momentive's Surface Curing Thermally Conductive Silicone Compounds cure upon exposure to atmospheric moisture to form a cured exterior surface, while maintaining a pasty mass consistency on the interior. These materials provide the combined benefit of low thermal resistance and repairability of a thermal grease, and the extreme low bleed and volatile contents of curable thermal materials, and help contribute to the stability of the thermal interface under harsh operating conditions.
Cured Exterior Surface

Thermal Management Fundamentals
Thermal Conductivity Thermal Conductivity is a property that describes the intrinsic ability of a material to conduct heat. It is commonly represented by the unit W/m.K, which measures the rate (watt) at which heat travels through a material where there is a temperature difference between two points (T1 - T2) over a specific distance (d).
k = thermal conductivity (W/m.K) q = rate of heat flow (W) T = temperature d = distance A = contact area

(T1 - T2) q = kA ________ d

Pasty Mass Heat Source

Thermal Conductivity can be further derived from this formula as follows: material is more efficient at conducting heat.

A higher k value (W/m.K) indicates that the

d q k = ___ . ______ (T1 - T2) A

Key features: . High thermal conductivity . Extremely low bleed and volatile content . Non-adhesive, repairable . Thixotropic, low viscosity. Conducive to syringe dispensing

Thermal Resistance Thermal Resistance describes the thermal properties of a material and how it resists heat at a specific thickness.
*

Image for illustration purposes

(T1 - T2) Rm = A _______ q
Thermal resistance is proportional to the thickness of the material, but it can be affected by gaps that occur between contact surfaces. These gaps create Contact Resistance, contributing to additional thermal resistance not represented in the above formula. Therefore, total thermal resistance in an application is represented by:

Product Details
Properties
Type Property Color Viscosity
(23 C)
o

Initial Performance Data
Thermal Resistance (mm2.K / W)

TIS360C
Semi-Flowable Gray
Pa.s h Exterior: Interior: W/m.K

TIS361C
Semi-Flowable Gray 120 0.5 Cured Layer Pasty Mass 3.6 8 (20µm) 2.92 0.006

Initial Properties 40

R = Rm + RC

1Part Condensation Cure 1Part Condensation Cure
(uncured)

Thermal Conductivity Unit Conversion Guide
30
TIS 360 C

Heat Spreader / Sink
The wetting properties of these materials also helps them fill microscopic gaps in uneven surfaces Die / Heat Spreader to minimize the effects of Momentive Performance Materials designs contact resistance. its thermal silicones to maximize thermal conductivity of the interface material (R2), and minimize the resistance between R1 and R3 through minimized bond lines.

150 2 Cured Layer Pasty Mass 3.6 8 (20µm) 2.92 0.006

20

Surface Cure Time Property
2

R1 R2 R3

Thermal Interface

There are several commonly used measurements of Thermal Conductivity. In addition to W/m.K, other potential units of measurement include cal/cm.soC and BTU-in/hr.ft2oF. Original Unit W/m.K cal/cm.soC BTU-in/hr.ft2oF Multiplier 2.4 x 10-3 6.94 4.2 x 102 0.14 Final Unit cal/cm.soC BTU-in/hr.ft2oF W/m.K W/m.K

(cured)



10

Thermal Conductivity1 Thermal Resistance Specific Gravity Volatile
Pkg
1
o

0

(BLT) mm2.K/W

25

50

75 BLT (µm)

100

125

(23 C)

Siloxane (D3-D10)
2

280g tube

Hot wire method, Laser flash Typical property values should not be used as specifications

·

·

Product Availability by Region1
Japan
TIG655 TIG830SP TIG4000 TIG210BX TIG2000 TIG1000 TIA500R TIA250R XE13-C1862PT TSE3282-G TSE3281-G XE11-C3165 XE11-C2148 XE11-B5320 TSE3380 TSE3331 TSE3331K TSE3081 TSE3080 TIS360C TIS361C
2Product name TSE3331K-EX

Other Electronic Solutions
· · · · · · · · · · · · · · · · · · · · ·
Comprehensive package of adhesion, sealing, coating, and encapsulation / potting solutions for a wide range of silicone applications in electric and electronic devices and component assemblies.

Reliability Data
Thermal Shock Reliability Thermal Resistance (mm2.K / W) Thermal Resistance (mm2.K / W) 20 16 12 8 4 0 Temperature / Humidity Reliability 10
Initial 100 hours 250 hours

5

TIS360C

250

Test Conditions: Sandwich material between10mm×10mm silicon dies, assemble at 50%RH for 7 days. Thermal cycle (-55oC 300kPa and cure at 23oC 125oC, dwell time 15 minutes at each extreme). Measure thermal resistance using laser flash method.
9

500 Cycles

750

1000

0

TIS360C

Test Conditions: Sandwich material between10mm×10mm silicon dies, assemble 50%RH for 7 days. High temperature at 300kPa and cure at 23oC / humidity test (85oC, 85%RH, 100 hours, 250 hours). Measure thermal resistance using laser flash method.

1Contact a Momentive Performance Materials sales representative for availability in regions not listed

· · · · · · · · · · · · · · · · · · · · ·

Korea

· · · · · · · · · · · · · · · · · · · ·

China

· · · · · · · · · · · · · · · · · · · · ·

US

· · · · · · · · · · · · · · · · · · · ·

Europe

2

2

12-page brochure providing opto-electronic solutions for LED Packages and Assemblies. Includes InvisiSil* LED encapsulants, Glob Top, Lens fabrication materials, Die Attach adhesives, and Dot Matrix assembly materials.

10

Principal Locations
Regional Information
North America World Headquarters 187 Danbury Road Wilton, CT 06897, USA Latin America Rodovia Eng. Constâncio Cintra, Km 78,5 Itatiba, SP - 13255-700 Brazil Europe, Middle East, Africa and India Leverkusen Germany Pacific Akasaka Park Building 5-2-20 Akasaka, Minato-Ku Tokyo 107-6112 Japan

Phone

Fax

800.295.2392

607.754.7517

+55.11.4534.9650 00.800.4321.1000 +31.164.293.276

+55.11.4534.9660 +31.164.241.750

+81.3.5544.3100

+81.3.5544.3101

Customer Service Centers
North America Charleston, WV 25314, USA E-mail: cs-na.silicones@momentive.com Specialty Fluids 800.523.5862 UA, Silanes, Resins, and Specialites 800.334.4674 RTV Products - Elastomers 800.332.3390 Sealants and Adhesives and Construction 877.943.7325 +54.11.4862.9544 +55.11.4534.9650 +52.55.5899.5132 +58.212.285.2149 304.746.1654 304.746.1623 304.746.1623

304.746.1654 +54.11.4862.9544 +54.11.4534.9660 +52.55.5899.5138 +58.212.285.2149

Latin America Argentina and Chile Brazil Mexico and Central America Venezuela, Ecuador, Peru, Colombia and Caribbean E-mail: cs-la.silicones@momentive.com Europe, Middle East, Africa and India E-mail: cs-la.silicones@momentive.com Pacific Japan China Korea Singapore E-mail: cs-ap.silicones@momentive.com Worldwide Hotline Worldwide Web

00.800.4321.1000 +31.164.293.276 +81.276.20.6182 +86.800.820.0202 +82.2.6201.4600 +65.6220.7022

+31.164.241.750

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