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Catalog excerpt: Silicone Solutions for Electronic devices
Silicone Solutions for Electronic Devices and Component Assemblies
Contents
Overview..................................................................1-2 Industry Overview...................................................3-4 Product Index Adhesives and Sealants .............................................5-6 Grease..........................................................................7 Coating Materials.......................................................7-8 Encapsulants / Potting Materials................................9-10 Selection Guide.....................................................11-12 Product Details 1 Part Condensation Cure........................................13-19 1 Part Heat (Addition) Cure......................................20-22 2 Part Room Temperature. Cure...............................23-25 2 Part Heat (Addition) Cure......................................26-28 1 Part & 2 Part Gels.................................................29-30 Junction Coating Resin (JCR) Grades.............................31 Grease.......................................................................32 Packaging Supplement.............................................32 UL Chart................................................................33-34 Technical Information..........................................35-36 FAQ............................................................................37
Silicone Product Profile
The products introduced in this selector guide consist of "RTV" (Room Temperature Vulcanizing) silicone products, that are commonly found in Electric and Electronic applications and component assemblies. This family of silicone products consists of both Room Temperature Cure and Heat (Addition) Cure grades. Momentive Performance Materials offers a comprehensive portfolio of silicone solutions to help meet a broad array of handling and performance needs in electronic components and assemblies. Selection of the appropriate type of RTV depends upon the required manufacturing process, handling requirements, curing conditions, equipment, and desired material properties.
RTV
1 Part
Condensation Cure Heat (Addition) Cure
Condensation Cure
Condensation cure silicone products cure when exposed to moisture in the environment at room temperature. These materials are categorized into Alkoxy, Acetoxy, or Oxime based on the byproducts that occur during cure.
Silicone
Silicone Varnish
Millable Silicone Rubber
2 Part
Silicone Oil
Condensation Cure Heat (Addition) Cure
Heat (Addition) Cure
Heat cure grades cure upon exposure to elevated heat or room temperature.
Relative Performance Characteristics
Property
Temperature Range Heat Resistance Flame Retardancy* UV Stability Ozone Stability Modulus
Silicone RTV
-50 ~ +200 C
o
Epoxy
-50 ~ +150 C
o
Urethane
-30 ~ +120 C
o
Excellent Excellent Excellent Excellent Low
Poor None Poor Poor High
Poor None Poor Poor High
* As a base material, silicone demonstrates flame retardant properties comparable to UL94HB.
1
APPLICATIONS
SEALING & ADHESION
Silicones are used in a wide array of applications for bonding components, and sealing against moisture or environmental contaminants. A comprehensive portfolio of 1 Part and 2 Part Adhesives and Sealants, many of which are excellent candidates for assembly applications on or near sensitive electrical and electronic components, are available. These materials are applied by a variety of methods ranging from manual dispensing to autodispensing units for tube, cartridge, pail, or drum packages. Mixing for 2 Part grades may be accomplished by either manual processes or meter mix dispensing, depending on production volume and post-mix material properties.
Performance Considerations - Temperature Resistance - Dielectric Resistance - Flame Retardancy - Low Volatility - Adhesion - Mechanical Strength - Hardness - Thermal Conductivity Process Considerations - Viscosity - Cure Mechanism - Cure Temperature - Cure Time - Pot Life
COATING
The Coating process involves the application of silicone in a thin protective layer to a component surface by methods such as dip, flow, spray, and selective robotic coating. Selection of a silicone coating material for a particular application involves the consideration of various performance and processing criteria.
Performance Considerations - Temperature Resistance - Dielectric Resistance - Flame Retardancy - Low Volatility - Stress Relief
Process Considerations - Viscosity - Cure Mechanism - Cure Temperature - Cure Time - Pot Life
POTTING & ENCAPSULATION
Silicone rubber and gels are widely used in electronics to ensure mechanical and environmental protection. A full range of products are offered in various cure speeds, viscosities, and performance, many of which offer enhancements for thermal cycling protection, stress relief, material strength, flame retardancy, or optical clarity.
Performance Considerations - Temperature Resistance - Dielectric Resistance - Flame Retardancy - Low Volatility - Stress Relief - Adhesion - Release Properties - Thermal Conductivity Process Considerations - Viscosity - Cure Mechanism - Cure Temperature - Cure Time - Pot Life
2
Industries Served
Electronic Devices and Power Modules
Momentive Performance Materials is a driving force as a supplier of advanced silicone technology to the electronics industry. Increasing electronic component densities and performance demands have created a need for specialized silicone solutions from Momentive for a broad mix of performance and handling requirements. Typical Applications: - Power converters - Inverters - Hybrid ICs - Micro-Electronic packaging - High-voltage component insulation - Membrane switches - Photo couplers
Board Assembly
Silicones are found in board-level adhesion, coating, and encapsulation applications, and contribute to the long-term, reliable performance of many components and assemblies. A wide portfolio of products is available, providing flame retardancy, thermal conductivity, temperature resistance, low-volatility, or high-purity benefits. Typical Applications: - Board-level component adhesion, fixing, and sealing - PCB coating - Component encapsulation - Junction Coating Resins
Consumer Electronics
Silicones are commonly used in a variety of consumer electronics applications. In addition to providing adhesion to many substrates, an array of grades are available to provide heat resistance, flame retardancy, low volatility for sensitive components, and moisture protection. Typical Applications: - Flat panel display electrode sealing - CRT wedges, bases, anodes - Steam iron plate seals - Air conditioner units - Control panel insulation - PCB fixing and sealing
3
Automotive Electronics
The automotive industry plays a critical role in integrating new electronic technologies. As more and more components migrate to electronic solutions, silicones play an increasingly important role in helping deliver material solutions that contribute to design flexibility and long-term component reliability under harsh operating conditions. Typical Applications: - ECU potting, sealing, coating - Wire connector sealing - Sealing, encapsulation in a broad range of sensors - HVAC system sealing - Vibration dampening - Headlamp assemblies
Aviation and Aerospace
Avionics and frame assembly needs in Aviation and Aerospace are served through silicone adhesives, coating, encapsulation and potting materials that help withstand stress and temperature extremes. Typical Applications: - Avionics - Circuit and terminal protection - Wire sealants - Engine gasketing - Cargo door, window sealing - Weatherstrip adhesives - Aviation lighting - Ventilation ducts
Solar Energy
Reliability of electronic components and the ability for panels to withstand harsh conditions over the lifecycle of the product are important considerations in solar energy applications. Momentive Performance Materials helps serve this growing industry with its range of potting materials and sealants. Typical Applications: - Terminal box potting - Box and base sealing - Aluminum frame and glass / EVA plate sealing
Feature
UL recognized non-flowable sealant. High-strength paste adhesive with UL recognition and Mil Spec. Paste adhesive with Mil Spec. Suitable for PC substrates. UL recognized, semi-flowable paste. Mil Spec. UL recognized paste adhesive. Mil Spec. Fast tack, UL recognized paste adhesive. Low volatile variant of TSE392. Fast tack,UL recognized paste adhesive. Fast tack, thermally conductive paste adhesive. UL recognized. Fast tack, thermally conductive flowable sealant. Mil Spec. Low volatile, UL recognized flowable sealant. Mil Spec. Fast tack, low volatile, UL recognized paste adhesive. Fast tack, low volatile, thermally conductive paste. UL recognized. Flowable adhesive / sealant. Mil Spec. Flowable adhesive / sealant. Mil Spec. Fast tack variant of TSE397. Fast tack, low volatile adhesive / sealant. Mil Spec. Low volatile, temperature resistant sealant. UL recognized. Fast tack, low volatile, thermally conductive paste adhesive. Electro-conductive paste adhesive. Fuel, solvent, chemical, and temperature-resistant fluoro sealant. UL recognized paste adhesive. FDA, USDA, and NSF compliant. UL recognized, temperature-resistant adhesive. FDA, USDA, and NSF compliant. FDA, USDA, and NSF compliant paste adhesive. Mil Spec. Temperature-resistant adhesive. FDA, USDA, and NSF compliant. Mil Spec. Temperature-resistant flowable sealant. FDA, USDA, and NSF compliant. Mil Spec. High strength paste / adhesive. High strength paste / adhesive. Temperature-resistant. Fast tack, general purpose paste adhesive. Fast tack, general purpose adhesive paste. UL recognized. Fast tack adhesive for high-temperature applications. UL recognized general purpose adhesive / sealant. UL recognized general purpose adhesive / sealant. UL recognized general purpose adhesive / sealant. General purpose flowable adhesive / sealant. Flowable sealant for high-temperature applications. Paste type adhesive / sealant for high-temperature applications. Flowable general purpose adhesive / sealant. Paste adhesive with fast cure capability at elevated temperatures. Good storage stability. Thixotropic adhesive / sealant. Flowable adhesive / sealant. Flowable adhesive / sealant. UL recognized, semi-flowable adhesive / sealant. UL recognized, high temperature-resistant adhesive / sealant. UL recognized, high temperature-resistant adhesive / sealant. High temperature-resistant adhesive / sealant. High temperature-resistant adhesive / sealant. Thermally conductive adhesive. Thermally conductive adhesive. High thermally conductive adhesive. General purpose adhesive / sealant. High strength adhesive with fast tack and cure performance. Extreme low temperature resistant sealant. Release capability. Semi-flowable temperature-resistant sealant. Release capability. General purpose, semi-flowable adhesive / sealant. General purpose adhesive / sealant. Thermally conductive adhesive. Fast cure at elevated temperatures. Heat resistant, thermally conductive adhesive.
Regulatory restrictions may apply to certain products in certain countries. Please contact a Momentive Performance Materials sales representatives for availability in specific regions or countries.
P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. MIL-A-46106B P. MIL-A-46106B P. MIL-A-46106B P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P.
MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B
Feature
Fast cure conformal coating material. Solvent free Fast cure conformal coating material. Low volatile. Solvent free High purity repairable electrode coating. Fast tack. High purity, non-repairable type electrode coating. UL recognized. High purity, non-repairable type electrode coating. UL recognized. UL recognized flowable sealant. Fast tack, thermally conductive flowable sealant. Mil Spec. Low volatile, UL recognized flowable sealant. Mil Spec. Flowable sealant. Mil Spec. Flowable sealant. Mil Spec. Fast tack variant of TSE397. Fast tack, low volatile sealant. Mil Spec. Low volatile, temperature resistant sealant. UL recognized. Pourable coating / encapsulant. Mil Spec. Low viscosity coating / potting material. Mil Spec. Low viscosity variant of TSE399. Low volatile variant of TSE399. Low volatile variant of TSE3991. Low volatile, UL recognized, thermally conductive coating & potting. General purpose coating / encapsulant. FDA, USDA, and NSF compliant. Mil Spec. General purpose flowable sealant / coating. Flowable sealant for high-temperature applications. Flowable, general purpose sealant / coating. Flowable, UL recognized coating / sealant. Extreme low viscosity coating material with UV tracer. Flowable sealant / coating material. Flowable coating / encapsulant. Flowable coating / encapsulant. Flowable coating material. Flowable coating material. Flowable coating material. UL recognized coating / encapsulation. Flowable coating / encapsulant. High purity JCR-grade white rubber. High purity JCR-grade transparent rubber High purity JCR-grade black rubber. High purity JCR-grade white gel. High purity JCR-grade translucent gel. General purpose encapsulation and potting. FDA compliant. Extreme low temperature-resistant coating. Excellent release properties. Low volatile, extreme low temperature-resistant coating. Release capability. General purpose coating / potting material. Mil Spec. General purpose coating / potting material. Mil Spec. Transparent coating / encapsulant. Fast cure at elevated temperatures. Thermally conductive coating / encapsulant. UL recognized, thermally conductive, coating / encapsulant. Low viscosity variant of TSE3331. Low viscosity variant of TSE3331. High purity JCR-grade translucent rubber. High purity JCR-grade translucent rubber. High purity JCR-grade thixotropic gel.
TSE3331K for Asia Pacific, TSE3331K EX for Europe and the Americas
Performance Feature
Thermally Conductive
Moderate thermal conductivity with heat resistance. General electrical insulation. Swell resistant on silicone. General electrical insulation, arc resistance. Insulator protection from salt, dust. Moderate thermal conductivity. Moderate thermal conductivity, low-bleed performance. Moderate thermal conductivity. High thermal conductivity.
· · · · ·
Low Bleed
Low Volatility
·
· · · · · ·
Heat Resistant
·
Product Detail
P. P. P. P. P. P. P. P. 32 32 32 32 32 32 32 32
Regulatory restrictions may apply to certain products in certain countries. Please contact a Momentive Performance Materials sales representatives for availability in specific regions or countries.
P. P. P. P. P. P. MIL-A-46146B P. MIL-A-46146B P. MIL-A-46146B P. MIL-A-46146B P. MIL-A-46146B P. MIL-A-46146B P. MIL-A-46146B P. MIL-A-46146B P. MIL-A-46146B P. MIL-A-46146B P. MIL-A-46146B P. MIL-A-46146B P. MIL-A-46146B P. MIL-A-46106B P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. MIL-PRF-23586F P. MIL-PRF-23586F P. P. P. P. P. P. P. P. P.
Cured Property
Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Gel Gel Gel Gel Gel Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Rubber Gel Gel Gel Gel Gel Gel Gel Gel Gel
Feature
UL recognized flowable encapsulant. Pourable coating / encapsulant. Mil Spec. Low viscosity potting / coating material. Mil Spec. Low viscosity variant of TSE399. Low volatile variant of TSE399. Low volatile variant of TSE3991. Low volatile, UL recognized, thermally conductive coating & potting. General purpose coating / encapsulant. FDA, USDA, and NSF compliant. Mil Spec. Temperature-resistant flowable sealant. FDA, USDA, and NSF compliant. Mil Spec. Flowable coating / encapsulant. Flowable coating / encapsulant. UL recognized coating / encapsulation. Flowable coating / encapsulant. Low viscosity potting gel. UL recognized variant of TSE3051. Low penetration variant of TSE3051. High strength variant of TSE3051. High penetration gel. General purpose encapsulation and potting. FDA compliant. Low viscosity, vibration-dampening soft rubber potting material w/ visual clarity. High temperature resistant potting, Excellent release properties. General purpose sealant with excellent release properties. FDA compliant. Extreme low temperature-resistant potting. Excellent release properties. High-low temperature resistant potting. Excellent release properties. Low volatile, high-low temperature-resistance. Low volatile, extreme low temperature-resistant potting. Release capability. Extreme high temperature-resistant coating / potting. Release capability. General purpose potting / coating material. Mil Spec. General purpose potting / coating material. Mil Spec. High temperature-resistant coating / potting. Release capability and Mil Spec. Flowable potting / encapsulant with excellent release properties. Flowable potting / encapsulant with excellent release properties. Flowable encapsulant / potting material. UL recognized, flowable encapsulant / potting material. High strength potting material. Fast cure at elevated temperatures. UL recognized low-viscosity encapsulant. Fast cure at low temperatures. Transparent potting / encapsulant with excellent release properties. Low viscosity, transparent potting material. Fast cure at elevated temperatures. Thermally conductive encapsulant / coating. UL recognized, thermally conductive, coating / encapsulant. Low viscosity variant of TSE3331. Low viscosity variant of TSE3331. High-strength potting / encapsulant. UL recognized, thermally conductive encapsulant. Low temperature cure. UL recognized, thermally conductive potting material. Release capability. UL recognized, thermally conductive potting material. Release capability. UL recognized low-viscosity potting material. Low temperture cure. Release capability. Low viscosity potting material. Excellent release properties. Low viscosity potting gel with extreme fast cure at low temperatures. Low viscosity potting gel with fast cure at low temperatures. Extended low temperature performance potting gel. High strength potting gel with extended pot life characteristics. Fast cure at low temperatures. Low volatile potting gel. High-elongation gel with low temperature cure. Thermally conductive potting gel. Thermally conductive potting gel.
TSE3331K for Asia Pacific, TSE3331K EX for Europe and the Americas
9
Regulatory restrictions may apply to certain products in certain countries. Please contact a Momentive Performance Materials sales representatives for availability in specific regions or countries.
P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. MIL-PRF-23586F P. MIL-PRF-23586F P. MIL-PRF-23586F P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P. P.
MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46146B MIL-A-46106B MIL-A-46106B
Medium Viscosity-Flowable Low Viscosity - Flowable
Viscosity and flowability of the silicone material are often key factors in the selection of a material for use in sealing, coating, and encapsulation / potting applications. A broad array of material performance and viscosity combinations are provided to help match the requirements of many applications.
Application Geometry and Cure Chemistry Options
The shape and conditions of the part are important in selecting the suitable silicone grade for each application. The following are some general guidelines:
Enclosed System Selection Options:
- 1 Part Heat Cure - 2 Part Heat Cure
12mm
- 1 Part Heat Cure - 2 Part Room Temp. Cure - 2 Part Heat Cure
12
Product Details - 1 Part Condensation Cure Grades
Properties
Cure Chemistry Flowability Product Details: 1 Part Condensation Cure Features and Benefits Adhesive / Sealant Coating Encapsulant / Potting
(23 C)
o
RTV167
Alkoxy
RTV133
Alkoxy
TSE385
Alkoxy
Paste adhesive with MIL-A-46146B. Suitable for polycarbonate substrates
TSE3854D
Alkoxy
Paste adhesive with MIL-A-46146B. UL recognition
TSE392
Alkoxy
Fast tack paste adhesive with MILA-46146B. UL recognition
TSE3925
Alkoxy
Fast tack, low volatile paste adhesive with MIL-A-46146B.
TSE3940
Alkoxy
Fast tack paste adhesive with MILA-46146B. UL recognition
Non-Flowable Non-Flowable Non-Flowable Non-Flowable Non-Flowable Non-Flowable Non-Flowable
High strength, paste UL recognized paste adhesive with MILA-46106B and UL recognition adhesive.
·
-
·
650 60 1.23 46 4.5 (650) 250
3
·
-
·
15 1.32 40 2.7 (390) 260
2
·
5
·
5 1.04 30 1.6 (230) 350
2
·
5
Viscosity
Application Rate Tack Free Time Specific Gravity Hardness Tensile Strength Elongation Adhesive Strength Thermal Conductivity Volume Resistivity Dielectric Strength Dielectric Constant Dissipation Factor Flame Retardancy Low Volatility Temperature Resistance Thermally Conductive FDA Electro-Conductivity MIL-Spec4 White Clear Black Gray Color
1JIS (60Hz) (23 C)
o
Low Molecular Siloxane (D3-D10) wt%
2AL-AL Lap Shear Adhesion 3 PBT Lap Shear Adhesion 4Testing is performed in accordance with current Momentive K 6249 5MIL-A-46146B corrosion test Performance Materials quality test methods, laboratory conditions, procedures, frequency and sampling. 6MIL-A-46106B Group I Type I
Application Rate Tack Free Time Specific Gravity Hardness Tensile Strength Elongation Adhesive Strength Thermal Conductivity Volume Resistivity Dielectric Strength Dielectric Constant Dissipation Factor Flame Retardancy Low Volatility Temperature Resistance Thermally Conductive FDA Electro-Conductivity MIL-Spec4 White Clear Black Gray 100g tube 120g tube 150g tube Color
1JIS (60Hz)
Low Molecular Siloxane (D3-D10) wt%
2ASTM D2196 3AL-AL Lap Shear Adhesion 4Testing is performed in accordance with current Momentive Performance Materials K 6249 5MIL-A-46146B corrosion test quality test methods, laboratory conditions, procedures, frequency and sampling.
Application Rate Tack Free Time Specific Gravity Hardness Tensile Strength Elongation Adhesive Strength Thermal Conductivity Volume Resistivity Dielectric Strength Dielectric Constant Dissipation Factor Flame Retardancy Low Volatility Temperature Resistance Thermally Conductive FDA Electro-Conductivity MIL-Spec4 White Clear Black Gray Red Aluminum Color
1JIS (60Hz) (23 C)
o
Low Molecular Siloxane (D3-D10) wt%
4Testing is performed in accordance with current Momentive Performance K 6249 2AL-AL Lap Shear Adhesion 3 PBT Lap Shear Adhesion Materials quality test methods, laboratory conditions, procedures, frequency and sampling 5MIL-A-46106B Group I Type I 6MIL-A-46106B Group III Type I
Typical property data values should not be used as specifications
18
Product Details - 1 Part Condensation Cure Grades
Properties
Cure Chemistry Flowability Product Details: 1 Part Condensation Cure Features and Benefits Application FDA Electro-Conductivity MIL-Spec3 White Clear Black Red 2.8fl oz. (83ml) tube 10.1fl oz. (299ml) cart. 10.3fl oz. (305ml) tube 5 gal. (18.9 ltr) pail 55 gal. (208.2 ltr) drum See Page 32 for details Packaging
19
IS806
Acetoxy
High temperature, paste adhesive. FDA, USDA, NSF, UL recognition
TSE370
Acetoxy
Fast tack paste adhesive
RTV116
Acetoxy Flowable
High temperature resistant, flowable adhesive. FDA, USDA, NSF, MIL-A-47040, MIL-A-46106B
RTV110 series
Acetoxy Flowable
Flowable adhesive with FDA, USDA, NSF, MIL-A-46106B
Cure Properties:
Condensation cure grades cure with exposure to atmospheric moisture. The cure process begins from the outer surface and proceeds inward. Therefore, deep section curing (in excess of 6mm) is not recommended. Typically, tack-free is achieved in 5-60 minutes at 25oC, 50%RH, depending on the grade.
6
Non-Flowable Non-Flowable
Adhesive / Sealant Coating Encapsulant / Potting
(23 C)
o
Typical property data values should not be used as specifications 1ASTM D2196 2Al-Al Lap Shear Adhesion 3Testing is performed in accordance with current Momentive Performance Materials quality test methods, laboratory conditions, procedures, frequency and sampling. 4MIL-A-46106B Group I Type II 5MIL-A-46106B Group III Type II
Shear Adhesive Strength MPa
lko x
39 2
0.2
y)
(A
E
Adhesion is typicaly achieved after 5-15 hours. Full material properties including electronic performance, is achieved in up to 7 days.
TS
0 1 2 3 4 5 6 7 Cure Time h 8
9
85
E3
10
0.1
TS
(A lko xy
TS
8 E3
2
(O x
im e)
)
Color
10
·
· · · ·
5 0
24
48
72 Cure Time h
Cure Time Test Method: Liquid silicone inserted in a 10mm diameter glass tube, and measurements of the cure length taken at specific intervals.
Manifestation of Adhesion
0.4
0.3
Product Details - 1 Part Heat Cure Grades
Properties
Flowability Features and Benefits Application
1JIS
XE13-B3208 Addisil 8101 TSE3212
Non-Flowable Non-Flowable Semi-Flowable
Paste adhesive / sealant Paste adhesive with fast cure at elevated temperatures. Good storage stability Thixotropic adhesive / sealant
TSE322
Flowable
Flowable adhesive / sealant
TSE322S TSE3261-G
Semi-Flowable
Flowable adhesive / sealant. UL recognition
Flowable
High temperature resistant flowable adhesive / sealant
Product Details: 2 Part Heat Cure
Adhesive / Sealant Coating Encapsulant / Potting
(23 C)
o
Cure Condition Specific Gravity Hardness Tensile Strength Elongation Adhesive Strength Thermal Conductivity Volume Resistivity Dielectric Strength Dielectric Constant Dissipation Factor Flame Retardancy
(23 C)
o
C/h
175/0.16 1.11 43 9.2 (1,340) 590 7
MPa (psi) % MPa (psi) W/m.K M.m kV/mm (60Hz)
4.4 (640) 430 3.7 (535)2 0.20 1.0x10 23 3.1 0.001
24.4 2.99 (50Hz) 0.002 (50Hz)
(60Hz)
Temperature Resistance Thermally Conductive White Clear Black Gray Blue 100g tube 310ml cart. 333ml cart. 1kg can 1.5kg can 18kg pail 20kg pail 25kg pail
K 6249
2AL-AL
· · · · · · ·
· · · ·
· · · ·
· · · · · ·
Cure Properties:
The cure performance of 1 Part Heat Cure grades is demonstrated by the relationship between temperature and hardness, and temperature and adhesive strength of TSE322 when placed in an oven at temperatures ranging from 80oC to 150oC.
Shear Adhesive Strength MPa
Hardness
Color Packaging
· · ·
Lap Shear Adhesion
Typical property data values should not be used as specifications
Hardness & Cure Time - TSE322
50 40 30 20 10 0
120 C
o
Typical property data values should not be used as specifications
22
Product Details - 2 Part Room Temperature Cure Grades
Properties
Components Flowability Product Details: 2 Part Room Temp. Cure Features and Benefits Application FDA MIL-Spec4 10g bottle 100g bottle 1kg can 1 pint (473 ml) can 1 gal. (3.8 ltr) pail Packaging
1JIS
RTV223
RTV210(A) RTV223(B)
6
RTV577
RTV577
6
RTV88
RTV88
6
RTV60
RTV60
6
RTV8262
RTV8262
RTV566
6 6
RTV41
RTV41
6
DBT
DBT
DBT
RTV9858 RTV566(A) RTV566(B)
DBT
Non-Flowable Non-Flowable Semi-Flowable
Fast RT cure, high strength adhesive offering flexible mix ratios and tack free times Low temperature resistant paste sealant with excellent release capabilities High temperature resistant, semi-flowable sealant. Excellent release capabilities
Flowable
High temperature resistant flowable sealant with excellent release capabilities
Flowable
High temperature, flowable compliance. Excellent release capabilities
Flowable
Low volatile, low out and High temperature performance capability
Flowable
Sealant with FDA compliance. Excellent release properties
sealant. MIL-PRF-23586F gassing sealant with Low
Adhesive / Sealant Coating Encapsulant / Potting
((A):(B) by weight)
2ASTM D2196 3AL-AL Lap Shear Adhesion 4Testing is performed in accordance with current Momentive Performance K 6249 5MIL-PRF-23586F 6Sub-Zero long-term storage Materials quality test methods, laboratory conditions, procedures, frequency and sampling. required.
· · · · ·
· · · ·
· · ·
·
· · ·
23
RTV560
RTV560
6
RTV31
RTV31
6
RTV511
RTV511
6
RTV11
RTV11
6
RTV8112
RTV8112 RTV9858
RTV8111
RTV8111 RTV9891
TSE350
TSE350 CE61
TSE352
TSE352 CE61
RTV567
RTV567(A) RTV567(B)
6 6
DBT
DBT
DBT
DBT
Flowable
Flowable sealant with Low and High temperature performance capability. Excellent release capabilities
Flowable
High temperature resistant flowable release capabilities
Flowable
Low temperature resistant flowable release capabilities
Flowable
Sealant with Excellent release properties. FDA compliance
Flowable
Flowable sealant compliance
Flowable
Flowable sealant compliance
Flowable
Flowable potting / encapsulant with excellent release properties
Flowable
Flowable potting / encapsulant with excellent release properties
Flowable
Low volatile, low temperature resistant sealant. Excellent release properties
Typical property data values should not be used as specifications
24
Product Details - 2 Part Room Temperature Cure Grades
Properties
Components Flowability Product Details: 2 Part Room Temp. Cure Features and Benefits Application FDA 30g bottle 80g bottle 500g bottle 1kg can 1.6kg can 18kg pail 20kg pail 1 lb. (454g) kit 42 lb. (19kg) kit 420 lb. (190kg) kit
Typical property data values should not be used as specifications 1JIS K 6249 2ASTM D2196 3AL-AL Lap Shear Adhesion
25
TSE3663
Flowable
/ adhesive
TSE3664
Flowable
/ adhesive with fast recognition
RTV12
RTV12(C)
Cure Speed:
The cure speed of 2 Part Condensation Cure grades can be changed by adjusting the amount of the catalyst component. However, the postcure properties of the material may vary from those achieved under standard mixing ratios, and therefore, adequate testing and confirmation prior to use in an application is required.
Product Details - 2 Part Heat Cure Grades
Properties
Components Flowability Features and Benefits Application FDA Packaging
1JIS
TSE3360 XE14-A0425 TSE3320
Non-Flowable Semi-Flowable Semi-Flowable
General purpose extended pot life High temperature Flowable paste adhesive with performance paste adhesive with resistant paste adhesive performance
TSE3337
Flowable
and encapsulation material.
TSE3380
Flowable
paste adhesive.
TSE3423
Flowable
/ potting material with UL recognition, low temperature cure, and excellent release properties
Cure Condition Specific Gravity Hardness Tensile Strength Elongation Adhesive Strength Thermal Conductivity Volume Resistivity Dielectric Strength Dielectric Constant Dissipation Factor Flame Retardancy Low Volatility
(23 C)
o
C/h
MPa (psi) % MPa (psi) W/m.K M.m kV/mm (60Hz)
5.4 (785) 380 3.1 (450) 0.23 1.0x107 21 3.0 0.001
2.9 (420) 0.80 2.0x106 26 3.4 0.017
2.0 (290) 0.63 1.0x107 23 3.3 0.007
3.9 (565) 0.29 2.0x106 25 3.4 0.01
1.5 (220) 1.68 2.1x106 15 5.7 0.002
1.0 2.5x106 21 4.7 0.02 UL94 V-1
(60Hz)
Temperature Resistance Thermally Conductive 1kg can 20kg pail 25kg pail
2AL-AL
···· ··
Lap Shear Adhesion
· ·
· ··
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·
·
K 6249
Typical property data values should not be used as specifications
Cure Properties:
The cure performance of 2 Part Heat Cure grades is demonstrated by the relationship between temperature and hardness of TSE3380 when placed in an oven at temperatures ranging from 100oC to 150oC.
Hardness & Cure Time - TSE3380
80
150oC Hardness
70
120oC 100oC
60
50
30
60 Cure Time - min
90
120
26
Product Details - 2 Part Heat Cure Grades
Properties
Components Flowability Product Details: 2 Part Heat Cure Features and Benefits Application FDA 100g bottle 500g bottle 1kg can 1.5kg can 2.5kg can 5kg can 6kg can Packaging
27
RTV615
Flowable
Low viscosity encapsulant / potting material with FDA recognition
Encapsulant / potting Thermally conductive Thermally conductive Thermally conductive conductivity. material with UL recognition. material with UL recognition. material with UL recognition.
encapsulant / potting material with thermal encapsulant / potting encapsulant / potting encapsulant / potting material with UL recognition, release properties
capability to cure at RT. material with excellent
Adhesive / Sealant Coating Encapsulant / Potting
((A):(B) by weight) (mixed) (mixed) (23 C)
o o
* TSE3331K unavailable in Europe and the Americas * TSE3331K EX unavailable in Asia Pacific 1JIS K 6249 2ASTM D2196 3AL-AL Lap Shear Adhesion 4TSE3331K
unavailable in Europe and the Americas
5TSE3331K
EX unavailable in Asia
Pacific
TSE3431-H RTV6428 XE14-B7892
Flowable
Encapsulant / potting material with UL recognition, thermal conductivity, and excellent release properties
Low viscosity, UL recognition Low viscosity, low penetration Low viscosity, high strength Low viscosity, high penetration
0.7 (7) 125/2 0.97 85
1
Cure Condition Specific Gravity Penetration Thermal Conductivity Volume Resistivity Dielectric Strength Dielectric Constant Dissipation Factor Flame Retardancy White Transparent Gray Light Yellow 1kg can 15kg can 20kg can Packaging
1JIS (60Hz) (23 C)
o
Gel 100:100 Black 17 (170)1 12 125/2 1.01 70 0.18 1.0x107 15 2.7 0.001 <2
100:100 Translucent 63 (630) 72 150/1 1.10 70 1
Viscosity Pot Life
Pa.s (P) h
O
(23 C)
Cure Condition Specific Gravity Hardness Penetration Thermal Conductivity Volume Resistivity Dielectric Strength Dielectric Constant Dissipation Factor Na+K+ Packaging: 500g bottle
(60Hz) (23 C)
o
C/h
W/m.K M.m kV/mm
0.20 1.0x107 24 2.8 0.001 <2
(60Hz)
ppm
Typical property data values should not be used as specifications 1JIS K 6249
31
······
Product Details - Grease
Properties
Features and Benefits Color Specific Gravity Penetration Bleed
(150 C, 24h)
o
TSK5303 TSK5370 TSK550
Thermally conductive compound for medium resistance Compound for electrical insulation resistant performance Compound for electrical contact insulation and contaminants
TSK551
Compound for electrical contact insulation and contaminants
YG6111 YG6240 YG6260 TIG1000
Thermally conductive Thermally conductive compound for medium compound for medium oil separation oil separation Thermally conductive compound for medium low oil separation Thermally conductive compound for medium applications
heat dissipation. Heat and sealing with swell- protection against moisture protection against moisture heat dissipation. Low heat dissipation. Low heat dissipation. Extremely to high heat dissipation
White 2.34 330
%
o
White 270 1.5 0.2 1.0x105 2.5 0.0001 0.01
White 1.03 220 1.5 0.2 2.0x107 2.8 0.0002 120<
Green 1.03 220 1.0 0.3 2.0x107 2.8 0.0002 120<
White 2.45 310 0.4 0.1 0.84 2.0x106 5.0 0.006 0.01
White 2.45 290 0.0 0.4 0.84 2.0x106 5.0 0.006 0.003
White 2.30 300 0.5 0.1 0.84 2.0x107 5.0 0.005 0.003
0 0 0 0 0 0 0 0 0 D495 E x p r e s s e d a s t h e Arc Resistance number of seconds that (sec) PLC a material resists the 420 0 formation of a surfacec o n d u c t i n g p a t h 360 - 419 1 300 - 359 2 when subjected to an intermittently occurring 240 - 299 3 arc of high voltage, low 180 - 239 4 120 - 179 5 current characteristics.
TSE3944
White Gray White Gray White Gray White Clear White Black Clear White Black Black Black Black White Clear Clear Clear Clear Black Black Red Red Red Red Red Gray Gray Black Black Black Black Black Black Black Black Gray Gray Gray Gray Gray Gray Gray Gray
Resistance to ignition Mean Ignition when exposed to Time (sec) high temperatures. 120 Expressed as the 60 - 119 mean number of 30 - 59 seconds required to 15 - 29 ignite a specimen 7 - 14 when wrapped with an <7 energized ni-chrome resistive wire that dissipates a specified level of energy.
1 Part Condenstaion Cure 1 Part Heat Cure 2 Part
0
3
0
E56745
TSE3945 TSE3946 TSE397
0 0
1 0
0 0
E56745 E56745 E56745
UL Status
TSE3976-B XE11-A5133S TSE3051-FR TSE322S
E56745 E56745 E56745 E56745
TSE3253 TSE326
E56745 E56745
TSE3260
E56745
RTV6428
E36952
TSE3331
0
0
0
E56745
TSE3331K TSE3331K*EX TSE3423 TSE3431
E56745 E56745 E56745 E56745
TSE3431-H
0
1
1
E56745
TSE3664
Gray Gray Black Black
E56745
XE14-B7892
HWI
E56745
CTI E x p r e s s e d a s t h a t Tracking Index voltage which causes (volts) PLC tracking after 50 drops 600 0 of 0.1% ammonium 400 -599 1 chloride solution have 250 - 399 2 fallen on the material.
Ability to withstand PLC e l e c t r i c a l a r c i n g . Expressed as the 0 number of arc rupture 1 exposures required 2 to ignite a specimen 3 when the arc occurs 4 directly on the surface 5 or a specified distance above the test specimen.
Mean No. Expressed as the rate of Arcs PLC (inches per minute) a tracking path 120 0 thatbe 60 - 119 1 surfaceproduced on the can of the material 30 - 59 2 under standardized test 15 - 29 3 conditions. <15 4
Adheres completely, Adheres, but separates from surface when pulled, × Does not adhere 1 May corrode under some usage conditions, 2 Stress cracking may occur under some usage conditions,
3 YP9341,
4 XP80-A5363
Primer Propeties
Appearance Substrates Specific Gravity Drying Time Solvents
(23 C
O
: <10%, : 10-25%, : 25-75%, X : >75%
Test Method: o Volume change of cured silicone rubber after immersing 1 week at 25 C
36
Frequently Asked Questions
What does RTV mean? RTV stands for Room Temperature Vulcanization (cure). Despite the low-temperature connotations conveyed by this name, RTV silicones consist of both Room Temperture Cure and Heat Cure grades. What is the cure mechanism of a condensation cure product? Condensation cure silicone products cure when exposed to atmospheric moisture. Moisture in the air is generally required to cure (or vulcanize) condensation cure products. The cure process begins from the outer surface, and therefore time is required for complete cure. The cure time is affected by the reaction mechanism and viscosity of the material. Generally, at 25C and 50%RH, condensation cure RTV silicones cure through in 24 to 48 hours. Full physical properties may take up to 7 days to develop. What is the depth (bead thickness) limit for a condensation cure grade? For 1-part, condensation cure products, the depth (bead thickness) limitation is approximately 6mm (1/4"). For 2-part, condensation cure products, the depth (bead thickness) limitation is approximately 25mm (1"). Can I accelerate the cure time of a 1-part product? Condensation cure silicone cure rates depend on humidity, silicone thickness, and to a smaller degree heat. Increasing the relative humidity around the silicone or reducing the thickness of the material will reduce the time to cure the material. Increased heat (not over 50C) will somewhat reduce cure time but as mentioned will do so to a much smaller degree than humidity or thickness. What is the cure mechanism of an addition cure product? Addition cure silicone RTV products may be 1 or 2-part and cure when exposed to heat. Although some heat cure products can cure at room temperature, higher heat greatly accelerates the cure. 1-part heat cure products typically have an inhibitor in the formulation that stops the product from curing until an activation temperature, greater than room temperature, is achieved and the inhibitor is driven off and the cure reaction is allowed to proceed. What does "tack free time" mean? Tack free refers to the amount of time it takes for a condensation cure silicone product to form a cured outer layer (the cured outer layer is not tacky like uncured material). What is "mix ratio"? Mix ratio is a term used to state the amount of each material to be in a multi-component material. The mix ratios for 2-part products are described on the individual product data sheets and are given as a ratio by weight of each material. What does "pot life" or "work life" mean? The amount of time after a 2-part grade is mixed with its curing agent that it will remain useful or pliable. How do I remove silicone? Before it is cured: use a putty knife to remove any of the uncured paste. Wipe the area clean with isopropyl alcohol to remove any leftover residue. After it is cured: First mechanically remove as much of the silicone as you can with either a knife or a razor. A solvent (mineral spirits, toluene, xylene, acetone) can them be used to remove any oily residue or any remaining silicone, It may be necessary to soak the silicone in a solvent overnight to break it down. Can I thin a silicone? Silicone can be thinned using a solvent in which the silicone is miscible, generally an aromatic solvent such as toluene or xylene. As always, be sure to follow the producer's instructions when using solvent products and always use in a well-ventilated area. The shrinkage of the silicone and the cure time will increase with the addition of solvent. Alternative suggestions would include non-reactive fluids or an RTV with a lower viscosity. What can I do to improve the adhesion of the silicone adhesive to my parts? The first step to good adhesion is to have clean surfaces for the silicone to bond to. For difficult-to-bond-substrates, Momentive Performance Materials offers a number of primers that can be used to improve and maximize adhesion. How do I ensure that air is removed from 2-part grades? If you are hand mixing, air may become added to the material during the mixing process. Vacuum de-airing is most effective in removing air prior to use. Automated mixing equipment that utilizes a static mixer can eliminate the need to de-air prior to dispensing. On complex high-density electronics, air can sometimes be trapped under components during the potting process. Where this is a concern, potting under vacuum or vacuum de-airing after potting can remove the trapped air. An alternate approach may be to use a grade with a low viscosity and longer potlife and to cure at lower temperatures (if heat-cure grade), allowing entrapped air to escape prior to the cure of the material. What is cure inhibition, and how do I prevent it? Cure inhibition is a phenomenon that may be observed in addition-cure grades. These materials use a platinum catalyst to drive the curing reaction. Surfaces containing water, sulphur, nitrogen compounds, organic metal compounds, or phosphate compounds, may inhibit cure. Cure inhibition is characterized by a gummy or sticky appearance of the silicone at the interface between the silicone and offending substrate. Inhibition can be prevented by application of a barrier coat, cleaning of the offending material prior to application of the silicone material, replacing the offending material with a suitable alternative, or selection of a condensation cure grade.
FAQ
Other Electronic Solutions from Momentive Performance Materials
Provides detailed information on silicone materials used for thermal management applications in electronics and microelectronics. Includes SilCool* grease & adhesives, and conventional grades for adhesion, encapsulation and potting. Provides opto-electronic solutions for LED Packages and Assemblies. Includes InvisiSil* LED encapsulants, Glob Top, Lens fabrication materials, Die Attach adhesives, and Dot Matrix assembly materials.
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Dispensing Equipment Examples
Tube Type Dispensing Unit
Cartridge Type Dispensing Unit
Cartridge Air-Gun Dispensing Unit
Small Can Pump and Dispensing Unit
Pail Can Pump Unit
38
Principal Locations
Regional Information
North America World Headquarters 187 Danbury Road Wilton, CT 06897, USA Latin America Rodovia Eng. Constâncio Cintra, Km 78,5 Itatiba, SP - 13255-700 Brazil Europe, Middle East, Africa and India Leverkusen Germany Pacific Akasaka Park Building 5-2-20 Akasaka, Minato-Ku Tokyo 106-8550 Japan
Phone
Fax
800.295.2392
607.754.7517
+55.11.4534.9650 00.800.4321.1000 +31.164.293.276
+55.11.4534.9660 +31.164.241.750
+81.3.5544.3100
+81.3.5544.3101
Customer Service Centers
North America Charleston, WV 25314, USA E-mail: cs-na.silicones@momentive.com Specialty Fluids 800.523.5862 UA, Silanes, Resins, and Specialites 800.334.4674 RTV Products - Elastomers 800.332.3390 Sealants and Adhesives and Construction 877.943.7325 +54.11.4862.9544 +55.11.4534.9650 +52.55.5899.5132 +58.212.285.2149 304.746.1654 304.746.1623 304.746.1623
Latin America Argentina and Chile Brazil Mexico and Central America Venezuela, Ecuador, Peru, Colombia and Caribbean E-mail: cs-la.silicones@momentive.com Europe, Middle East, Africa and India E-mail: cs-la.silicones@momentive.com Pacific Japan China Korea Singapore Worldwide Hotline Worldwide Web
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