Nameplate for High temperature

From July 1st, 2006, the use of lead additives in dipping solder baths for printed circuit board assembly will be prohibited. As a result, process temperatures will rise to levels of up to 300°C. Standard labels can withstand such temperatures only for a short time - unlike the specially developed HighTemp-Label:

- Temperature Resistance: Permanent: +180°C
  Max.: +300°C up to 20 min
- Mechanical and Chemical Resistance: High abrasion resistance, resistance to
  chemicals, Zestron-resistant in reflow soldering processes.