Traditional joining techniques such as liquid adhesive bonding, bolting or riveting are time- and cost-intensive. DSAPs, on the other hand, yield assembly efficiencies – no drilling of holes, no curing times are needed. It is an optimum solution for joining, sealing, and insulating engineering components.
Product Features:
- Clean automatic application
- Reliable adhesion to difficult substrates
- Allows fast processing
- Easy removal enabled by special adhesives